Silicon Dioxide Lapping Film
High-Precision Polishing Film for Final Finishing and Fiber Height Control
Silicon Dioxide (SiO₂) Lapping Film is a precision-engineered abrasive film designed for ultra-fine polishing applications where minimal material removal and superior surface quality are required. It is particularly suited for the final polishing stage of fiber optic connectors such as MT, MPO, and MTP ferrules, as well as ceramics, glass, and other delicate materials.
Key Features:
Ultra-Fine Particle Size: Available in 0.02μm to 0.5μm for critical final polishing
Superior End-Face Quality: Delivers low insertion loss and high return loss performance
Uniform Abrasive Distribution: Precision-coated film ensures consistent results
Ideal for Wet Polishing: Compatible with deionized water for clean, slurry-free operation
Excellent for Fiber Height Control: Helps achieve controlled fiber protrusion in multi-fiber connectors
Typical Applications:
Final Step Polishing for MT/MPO/MTP connectors
Optical Fiber Connector End-Face Finishing
Ceramic, glass, and sapphire polishing
Photonic and semiconductor components finishing
Precision optics manufacturing
Available Specifications:
Micron Grade | Grit Size (μm) | Backing | Color | Format |
---|---|---|---|---|
0.02μm | Ultra-fine | Polyester | Light White | Sheet, Disc, or Roll |
0.05μm | Very fine | Polyester | White | Custom sizes available |
0.3μm | Fine | Polyester | Light White |
Customization Options:
Sheet sizes: 6" × 6", 8" × 10", A4, or custom
Disc sizes: 127mm, 203mm, 228mm, etc.
Rolls: Widths from 4" to 12", lengths up to 100 meters
Backing: High-strength polyester
Pressure-sensitive adhesive (PSA) backing optional
Polishing Process Guide for Silicon Dioxide Lapping Film
Final Polishing – Fiber Height Control & End-Face Quality
1. Preparation
Tools & Materials Needed:
Fiber optic polishing machine or fixture (e.g., for MT/MPO)
Silicon Dioxide lapping film (0.02–0.5 μm)
Flat glass or ceramic polishing plate
Deionized water (DI water)
Cleaning wipes (lint-free)
Compressed air (oil-free)
Ferrule holder with proper pressure setting
2. Machine & Setup Parameters
Parameter | Recommended Setting |
---|---|
Film Type | Silicon Dioxide (0.02–0.5 μm) |
Polishing Pressure | 40–60g/fiber or 0.2–0.4 MPa |
Polishing Speed | 60–120 rpm |
Time per Cycle | 30–90 seconds (depending on material) |
Environment | Clean room or dust-free polishing area |
Lubricant | DI Water (no slurry required) |
Note: Always ensure flat contact between the film and ferrules.
3. Cleaning Before Polishing
Clean ferrule end-face with lint-free wipe and isopropyl alcohol.
Rinse the lapping film with DI water to remove dust.
Ensure film is evenly adhered to the glass plate or fixture.
4. Final Polishing Process
Wet the Film
Lightly spray or apply DI water over the film surface. Avoid excess.Place Connector Fixture
Insert the ferrule holder into the polishing jig or machine with uniform pressure.Start Polishing
Run the machine at controlled speed and pressure for the specified time.Inspect & Repeat if Needed
Use interferometer or video scope to inspect end-face geometry and fiber protrusion.
Repeat polishing for uniform results.
5. Post-Polishing Inspection
Fiber Height (Protrusion): Typically 0–100 nm
Radius of Curvature: X > 2000 mm, Y > 50 mm (for MT-type ferrules)
End-face Geometry: No scratches, undercut, or pits
Cleanliness: Use IEC 61300-3-35 inspection standard
6. Cleaning After Polishing
Rinse connectors with DI water or alcohol.
Dry using lint-free wipe and compressed air.
Replace the film after signs of wear or every 50–100 connectors (depending on use).
Tips for Optimal Performance
Use only dedicated final polishing fixtures for consistency.
Keep polishing area clean to prevent contamination.
Replace film when fiber height becomes inconsistent.
Store films in a clean, dry environment.